NCMN NanoFab Equipment - IBM

Intlvac Nanoquest-I Ion Beam Etching and Milling System

This is a versatile R&D ion beam development platform for both thin film milling and deposition.  It works on almost all known solid materials.  It also includes eight magnetron sputtering guns for magnetic material disposition and a Secondary Ion Mass Spectrometry (SIMS) probe subsystem for precise etch.  The “SIMS” probe allows users to define etch end point and mount of over etch provides the required levels of sensitivity of end point detection.
Equipment Specification:
  • Base vacuum: 8 x 10-9 Torr
  • Ion beam energy: 100-1200 eV
  • Two gridded ion sources: 4 and 14cm
  • Three 100mm targets for ion beam sputtering
  • 8 magnetron sputtering
  • SIMS endpoint detector
  • Maximum wafer size:  4 inches (100 mm)
Training Material: